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surface mount pin diodes in sot-323 (sc-70 3-lead) technical data features ? diodes optimized for: low current switching low distortion attenuating ultra-low distortion switching microwave frequency operation ? surface mount sot-323 (sc-70)package single and pair versions tape and reel options available ? low failure in time (fit) rate* * for more information see the surface mount pin reliability data sheet. package lead code identification (top view) description/applications the hsmp-381b /c/e/f series is specifically designed for low distortion attenuator applications. the hsmp-386b /c/e/f series is a general purpose pin diode designed for low current attenua- tors and low cost switches. the hsmp-389b /c/e/f series is optimized for switching applica- tions where low resistance at low current, and low capacitance are required. the hsmp-48xb series is special products featuring ultra low parasitic inductance in the sot- 323 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional sot-323 pin diodes. the hsmp-481b diode is a low distortion attenuating pin designed for operation to 3 ghz. the hsmp-482b diode is ideal for limiting and low inductance switching applications up to 1.5 ghz. the HSMP-489B is optimized for low current switch- ing applications up to 3 ghz. common cathode f common anode e series c single b dual anode 482b / 489b dual cathode 481b hsmp-381 b/c/e/f hsmp-386 b/c/e/f hsmp-389 b/c/e/f hsmp-481b, -482b, -489b absolute maximum ratings [1] , t c = + 25 c symbol parameter unit absolute maximum i f forward current (1 m s pulse) amp 1 p iv peak inverse voltage v same as v br t j junction temperature c 150 t stg storage temperature c -65 to 150 q jc thermal resistance [2] c/w 300 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = 25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board.
2 electrical specifications, t c = +25 c, each diode pin attenuator diodes minimum maximum maximum minimum maximum part package breakdown total total high low number marking lead voltage resistance capacitance resistance resistance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) r h ( w )r l ( w ) 381b e0 b single 100 3.0 0.35 1500 10 381c e2 c series 381e e3 e common anode 381f e4 f common cathode test conditions v r = v br i f = 100 ma v r = 50 v i r = 0.01 ma i f = 20 ma measure f = 100 mhz f = 1 mhz f = 100 mhz f = 100 mhz i r 10 m a pin general purpose diodes minimum typical typical part package breakdown total total number marking lead voltage resistance capacitance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) 386b l0 b single 50 3.0 1.5* 0.20 386c l2 c series 386e l3 e common anode 386f l4 f common cathode test conditions v r = v br i f = 10 ma v r = 50 v measure f = 100 mhz f = 1 mhz i r 10 m ai f = 100 ma* pin switching diodes minimum maximum maximum part package breakdown total total number marking lead voltage resistance capacitance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) 389b g0 b single 100 2.5 0.30 389c g2 c series 389e g3 e common anode 389f g4 f common cathode test conditions v r = v br i f = 5 ma v r = 5 v measure f = 100 mhz f = 1 mhz i r 10 m a
3 electrical specifications, t c = +25 c, each diode, continued high frequency (low inductance, 500 mhz C 3 ghz pin diodes minimum maximum typical maximum typical part package breakdown series total total total number marking voltage resistance capacitance capacitance inductance hsmp- code configuration v br (v) r s ( w )c t (pf) c t (pf) l t (nh) application 481b eb dual cathode 100 3.0 0.35 0.4 1.0 attenuator 482b fa dual anode 50 0.6* 0.75* 1.0 1.0* limiter 489b ga dual anode 100 2.5** 0.33** 0.375* 1.0 switch test conditions v r = v br i f = 100 ma v r = 50 v v r = 50 v f =500 mhz C measure i f = 10 ma* f = 1 mhz f = 1 mhz 3 ghz i r 10 m ai f = 5 ma** v r = 20 v* v r = 5 v* v r = 20 v* v r = 5 v** typical parameters part number total resistance carrier lifetime reverse recovery time total capacitance hsmp- r t ( w ) t (ns) t rr (ns) (pf) 381a series 75 1500 300 0.27 386a series 22 500 80 0.20 389a series 3.8 200* test conditions i f = 1 ma i f = 50 ma v r = 10 v 50 v f = 100 mhz t r = 250 ma i f = 20 ma i f = 10 ma* 90% recovery i r = 6 ma* note: 1. package marking code is laser marked.
4 typical performance, t c = 25 c figure 2. rf capacitance vs. reverse bias, hsmp-386b/c/e/f series. 0.15 0.30 0.25 0.20 0.35 0.40 0.45 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) figure 1. rf capacitance vs. reverse bias, hsmp-381b/c/e/f series. 1 mhz 30 mhz frequency>100 mhz 0.15 0.30 0.25 0.20 0.35 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) 1 ghz 100 mhz 1 mhz 10000 1000 100 10 1 0.1 rf resistance (ohms) i f ?forward bias current (ma) 0.01 0.1 1 10 100 hsmp-381b/c/e/f, -481b hsmp- 386b/c/e/f hsmp-482b hsmp-389b/c/e/f, -489b figure 3. total rf resistance at 25 c vs. forward bias current. 10000 1000 100 10 1.0 total rf resistance (ohms) 0.01 0.1 1 10 100 i f ?forward bias current (ma) t a = +85 c t a = +25 c t a = 55 c figure 4. rf resistance vs. forward bias current for hsmp-381b/c/e/f series and hsmp-481b. 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 1020304050 v r ?reverse voltage (v) c t ?capacitance (pf) figure 5. capacitance vs. reverse voltage at 1 mhz. hsmp-381b/c/e/f hsmp-386b/c/e/f hsmp-389b/c/e/f 120 110 100 90 80 70 60 50 40 1000 100 10 diode mounted as a series attenuator in a 50 microstrip and tested at 123 mhz diode rf resistance (ohms) figure 6. 2nd harmonic input intercept point vs. diode rf resistance for attenuator diodes. input intercept point (dbm) 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 7. 2nd harmonic input intercept point vs. forward bias current for switch diodes. input intercept point (dbm) hsmp-3880 hsmp-386b/c/e/f hsmp-389b/c/e/f diode mounted as a series switch in a 50 microstrip and tested at 123 mhz 1000 100 10 10 20 30 t rr - reverse recovery time (ns) forward current (ma) figure 9. reverse recovery time vs. forward current for various reverse voltages. hsmp-386b/c/e/f series. v r = 5v v r = 10v v r = 20v forward current (ma) figure 8. reverse recovery time vs. forward current for various reverse voltages. hsmp-482b. t rr ?reverse recovery time (ns) 1 10 100 10 20 30 v r = 2 v v r = 5 v v r = 10 v hsmp-381b/c/e/f hsmp-482b
5 typical performance, t c = 25 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 11. forward current vs. forward voltage. hsmp-381b/c/e/f series and hsmp-481b. 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (v) figure 13. forward current vs. forward voltage. hsmp-386b/c/e/f series. 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (v) figure 14. forward current vs. forward voltage. hsmp-389b/c/e/f series and HSMP-489B. 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 12. forward current vs. forward voltage. hsmp-482b. 125 c 25 c ?0 c 200 160 120 80 40 0 10 20 15 25 30 t rr ?reverse recovery time (ns) forward current (ma) figure 10. typical reverse recovery time vs. reverse voltage. hsmp-389b/c/e/f series. v r = 2v v r = 5v v r = ?0v
6 typical applications for multiple diode products rf common rf common rf 1 bias 1 bias bias rf 2 bias 2 figure 15. simple spdt switch, using only positive bias current. figure 16. high isolation spdt switch. rf 2 rf 1 rf common rf 1 rf 2 bias figure 17. spdt switch using both positive and negative bias current. figure 18. very high isolation spdt switch. rf common rf 2 rf 1 bias
7 typical applications for multiple diode products (continued) input rf in/out figure 19. four diode p attenuator. figure 20. high isolation spst switch (repeat cells as required). fixed bias voltage variable bias bias
8 figure 21. internal connections. 12 3 12 3 HSMP-489B hsmp-481b typical applications for hsmp-48xx low inductance series figure 22. circuit layout. microstrip series connection for hsmp-48xb series in order to take full advantage of the low inductance of the hsmp-48xb series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in figure 21. microstrip shunt connections for hsmp-48xb series in figure 23, the center conductor of the microstrip line is inter- rupted and leads 1 and 2 of the hsmp-48xb series diode are placed across the resulting gap. this forces the 0.5 nh lead induc- tance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. the 0.3 nh of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. figure 23. circuit layout. 50 ohm microstrip lines pad connected to ground by two via holes 0.3 nh 0.3 nh 0.3 pf* 1.5 nh 1.5 nh *0.8 pf typical for hsmp-482b figure 24. equivalent circuit.
9 figure 25. circuit layout. co-planar waveguide shunt connection for hsmp-48xb series co-planar waveguide, with ground on the top side of the printed circuit board, is shown in figure 25. since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. co-planar waveguide groundplane center conductor groundplane typical applications for hsmp-48xx low inductance series (continued) *0.8 pf typical for hsmp-482b figure 26. equivalent circuit. 0.3 pf* 0.75 nh
10 assembly information sot-323 pcb footprint a recommended pcb pad layout for the miniature sot-323 (sc-70) package is shown in figure 27 (dimensions are in inches). this layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair performance. 0.026 0.035 0.07 0.016 figure 27. pcb pad layout (dimensions in inches). smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot-323 package, will reach solder reflow temperatures faster than those with a greater mass. agilents sot-323 diodes have been qualified to the time-tem- perature profile shown in figure 28. this profile is representative of an ir reflow type of surface mount assembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c. these parameters are typical for a surface mount assembly process for agilent sot-323 diodes. as a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 28. surface mount assembly profile.
11 device orientation user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view ## ## ## ## note: ?#?represents package marking code. tape dimensions for outline sot-323 (sc-70 3 lead) p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies obsoletes 5966-2323e 5967-6070e (11/99) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches) package dimensions outline sot-323 (sc-70) package characteristics lead material ........................................................................................ copper lead finish............................................................................. tin-lead 85/15% maximum soldering temperature ............................... 260 c for 5 seconds minimum lead strength ........................................................... 2 pounds pull typical package inductance ................................................................... 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) option C blk = bulk, 100 pcs. per antistatic bag option C tr1 = tape and reel, 3000 devices per 7" reel conforms to electronic industries rs-481, taping of surface mounted components for automated placement. standard quantity is 3,000 devices per reel. ordering information specify part number followed by option. for example: hsmp- 38xa C xxx bulk or tape and reel option part number surface mount pin agilent

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